Taiwan / US / Korea · Chips & Networking
Leading-Edge Chipmaking (Foundry)
One company produces almost all leading-edge AI logic. N3/N2 capacity is allocated years ahead and every new fab is a multi-year, tens-of-billions bet.
EUV + tools→Wafer starts→Leading-node logic→Packaging
84
Tightness score ⓘ
#6 of 56
▲ Tightening
Lead time
24–36 mo
Theme 1M
−24.4%% in uptrend
0%Metric to watch
TSMC monthly revenue, N2 ramp commentary, and capex guidance revisions.
What would prove us wrong
Weakens if leading-node utilisation falls while packaging and HBM stay loose — logic would no longer bind.
Foundry theme performance
Equal-weight · rebased 100 · 1YStocks we track
Who controls this bottleneck
Roles, not recommendations. Delayed prices; local currency.
| Stock | Role | Listing | Last | 1D | 1M | 3M | YTD | Off 52w high | Trend | Next earnings |
|---|---|---|---|---|---|---|---|---|---|---|
| TSM Taiwan Semiconductor |
Leading-node foundry and CoWoS packaging chokepoint | NYSE Taiwan |
$406.1 | −5.95% | −11.6% | +0.3% | +34.7% | −16.4% | 2027-01-14 | |
| INTC Intel |
US foundry rebuild with advanced-packaging optionality | NASDAQ US |
$65.76 | −28.58% | −45.2% | −27.7% | +78.2% | −53.3% | 2027-01-28 | |
| 005930.KS Samsung Electronics |
HBM, DRAM and foundry across memory and logic | KRX Korea |
₩225,000 | −3.02% | −17.4% | +2.3% | +88.2% | −37.9% | 2027-01-27 | |
| GFS GlobalFoundries |
Specialty-node foundry incl. silicon photonics | NASDAQ US |
$41.90 | −8.62% | −13.9% | −16.0% | +20.5% | −53.2% | 2026-11-04 | |
| UMC United Microelectronics |
Mature-node foundry and interposer capacity | NYSE Taiwan |
$16.68 | −7.54% | −33.8% | −10.8% | +116.0% | −39.4% | 2027-01-27 |
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