TSM Taiwan Semiconductor
Leading-node foundry and CoWoS packaging chokepoint
Fundamentals from public market data, refreshed daily (2026-10-30 21:21 UTC). Figures in reporting currency.
TSM · price with what management and the data said
Timeline: management commentary, data & earnings
9 events-
9
2026-10-15C.C. Wei, CEO (Q3 call)Supply tightening
"The demand is extremely robust. We did not see any sign of slowdown." and "The gap between demand and supply are still quite big." Gross margin 66.4%. Source ↗
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8
2026-10-08TSMC monthly revenueData release
September revenue NT$511.9B, +54.6% y/y (−0.6% m/m vs record August). Q3 revenue a record NT$1.49T, above the top of guidance. Source ↗
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7
2026-07-16EarningsBeat / raise
Reported EPS 4.31 vs 3.89 expected (+10.9% surprise).
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6
2026-04-15EarningsBeat / raise
Reported EPS 3.49 vs 3.33 expected (+4.7% surprise).
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5
2026-01-15EarningsBeat / raise
Reported EPS 3.14 vs 2.98 expected (+5.5% surprise).
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4
2025-10-15EarningsBeat / raise
Reported EPS 2.92 vs 2.63 expected (+11.2% surprise).
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3
2025-07-17EarningsBeat / raise
Reported EPS 2.47 vs 2.31 expected (+6.8% surprise).
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2
2025-04-17EarningsBeat / raise
Reported EPS 2.12 vs 2.05 expected (+3.2% surprise).
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1
2025-01-16EarningsBeat / raise
Reported EPS 2.24 vs 2.22 expected (+0.7% surprise).
Latest headlines
Auto-updated daily- Taiwan Semiconductor Manufacturing Company Ltd. (TSM) is Attracting Investor Attention: Here is What You Should Know2026-10-30
- Applied Materials vs. Taiwan Semiconductor Manufacturing: Comparing Revenue Growth Trends Between These Artificial Intelligence Companies2026-10-30
- ICM Realty Group and Concord Capital Management to Introduce U.S. Sunbelt Industrial Opportunities in Taiwan2026-10-30
- Why Bell Global Equities Fund Continues to Favor Taiwan Semiconductor Manufacturing Company (TSM)2026-10-29
Alternative data that moves TSM
Earnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-10-15 | 4.52 | 4.6 | +1.7% |
| 2026-07-16 | 3.89 | 4.31 | +10.9% |
| 2026-04-15 | 3.33 | 3.49 | +4.7% |
| 2026-01-15 | 2.98 | 3.14 | +5.5% |
| 2025-10-15 | 2.63 | 2.92 | +11.2% |
| 2025-07-17 | 2.31 | 2.47 | +6.8% |
| 2025-04-17 | 2.05 | 2.12 | +3.2% |
| 2025-01-16 | 2.22 | 2.24 | +0.7% |
| 2024-10-17 | 1.79 | 1.94 | +8.4% |
| 2024-07-18 | 1.42 | 1.48 | +4.0% |
| 2024-04-18 | 1.32 | 1.38 | +4.5% |
| 2024-01-18 | 1.37 | 1.44 | +5.1% |
| 2023-10-18 | 1.17 | 1.29 | +10.3% |
| 2023-07-20 | 1.08 | 1.14 | +5.5% |
| 2023-04-20 | 1.19 | 1.31 | +10.2% |
| 2023-01-12 | 1.76 | 1.82 | +3.4% |
| 2022-10-13 | 1.68 | 1.79 | +6.3% |
| 2022-07-13 | 1.5 | 1.55 | +3.0% |
| 2022-04-14 | 1.31 | 1.4 | +6.9% |
| 2022-01-13 | 1.12 | 1.15 | +2.7% |
| 2021-10-14 | 1.04 | 1.07 | +3.4% |
| 2021-07-15 | 0.92 | 0.93 | +0.9% |
| 2021-04-15 | 0.93 | 0.96 | +2.8% |
| 2021-01-14 | 0.94 | 0.97 | +2.7% |
About Taiwan Semiconductor
Website ↗Taiwan Semiconductor Manufacturing Company Limited, together with its subsidiaries, manufactures, packages, tests, and sells integrated circuits and other semiconductor devices in Taiwan, China, Europe, the Middle East, Africa, Japan, the United States, and internationally. It provides various wafer fabrication processes, such as processes to manufacture complementary metal- oxide-semiconductor (CMOS) logic, mixed-signal, radio frequency, embedded memory, bipolar CMOS mixed-signal, and others. The company also involved in providing customer and engineering support services; manufacturing of masks; investment in technology start-up companies; research, designing, developing, manufacturing, packaging, testing, and sale of color filters; and investment activities. Its products are used in high performance computing, smartphones, Internet of things, automotive, and digital consumer electroni…
One company produces almost all leading-edge AI logic. N3/N2 capacity is allocated years ahead and every new fab is a multi-year, tens-of-billions bet.
What would prove us wrong. Weakens if leading-node utilisation falls while packaging and HBM stay loose — logic would no longer bind.
An accelerator is useless until logic and HBM are integrated on an interposer. 2.5D/3D capacity, hybrid bonders and TC bonders gate output.
What would prove us wrong. Weakens if CoWoS expansions run ahead of accelerator demand and OSAT utilisation drops.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| INTC Intel | US foundry rebuild with advanced-packaging optionality | $65.76 | −28.58% | −45.2% | +78.2% | |
| 005930.KS Samsung Electronics | HBM, DRAM and foundry across memory and logic | ₩225,000 | −3.02% | −17.4% | +88.2% | |
| GFS GlobalFoundries | Specialty-node foundry incl. silicon photonics | $41.90 | −8.62% | −13.9% | +20.5% | |
| UMC United Microelectronics | Mature-node foundry and interposer capacity | $16.68 | −7.54% | −33.8% | +116.0% | |
| ASX ASE Technology | Largest OSAT; takes CoWoS-class overflow | $39.50 | −11.34% | −11.7% | +147.8% | |
| AMKR Amkor Technology | Advanced packaging OSAT incl. US capacity | $39.50 | −4.15% | −25.3% | +0.5% | |
| BESI.AS BE Semiconductor | Hybrid bonding equipment leader | €154.0 | −5.72% | −19.5% | +15.9% | |
| 042700.KS Hanmi Semiconductor | TC bonders for HBM stacking | ₩182,700 | −7.21% | −27.5% | +43.9% | |
| 6146.T Disco | Dicing and grinding for thin wafers and HBM | ¥49,540 | −5.31% | −13.8% | +3.8% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.