AMKR Amkor Technology
Advanced packaging OSAT incl. US capacity
Fundamentals from public market data, refreshed daily (2026-10-30 21:21 UTC). Figures in reporting currency.
AMKR · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-10-26EarningsMiss / cut
Reported EPS 0.76 vs 0.78 expected (-3.1% surprise).
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7
2026-07-27EarningsBeat / raise
Reported EPS 0.7 vs 0.48 expected (+45.4% surprise).
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6
2026-04-27EarningsBeat / raise
Reported EPS 0.33 vs 0.24 expected (+35.6% surprise).
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5
2026-02-09EarningsBeat / raise
Reported EPS 0.69 vs 0.44 expected (+56.5% surprise).
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4
2025-10-27EarningsBeat / raise
Reported EPS 0.51 vs 0.43 expected (+19.6% surprise).
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3
2025-07-28EarningsBeat / raise
Reported EPS 0.22 vs 0.16 expected (+39.6% surprise).
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2
2025-04-28EarningsBeat / raise
Reported EPS 0.09 vs 0.09 expected (+4.5% surprise).
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1
2025-02-10EarningsBeat / raise
Reported EPS 0.43 vs 0.38 expected (+13.9% surprise).
Latest headlines
Auto-updated daily- ASE Technology Gains 5% as Packaging Rival Amkor Touts “Expanding Customer Commitments”2026-10-28
- Amkor Technology (AMKR) Stock Jumps As Q3 Earnings Reveal Margin Power2026-10-28
- AMKR Q3 deep dive: advanced packaging drives margin gains, guidance reflects communication headwinds2026-10-27
- Amkor Technology, Inc. Q3 2026 Earnings Call Summary2026-10-27
- Amkor Technology Halved Over The Last 6 Months: Two Chip Analysts Say 145% Returns Await Those Who Buy Now2026-10-27
- Amkor Q3 Earnings Call Highlights AI Growth and Capacity Expansion2026-10-27
- Is Amkor Technology (AMKR) Undervalued Following Mixed Q3 Results And Weak Guidance?2026-10-27
Earnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-10-26 | 0.78 | 0.76 | −3.1% |
| 2026-07-27 | 0.48 | 0.7 | +45.4% |
| 2026-04-27 | 0.24 | 0.33 | +35.6% |
| 2026-02-09 | 0.44 | 0.69 | +56.5% |
| 2025-10-27 | 0.43 | 0.51 | +19.6% |
| 2025-07-28 | 0.16 | 0.22 | +39.6% |
| 2025-04-28 | 0.09 | 0.09 | +4.5% |
| 2025-02-10 | 0.38 | 0.43 | +13.9% |
| 2024-10-28 | 0.5 | 0.49 | −2.7% |
| 2024-07-29 | 0.23 | 0.27 | +19.3% |
| 2024-04-29 | 0.13 | 0.24 | +80.9% |
| 2024-02-05 | 0.41 | 0.48 | +16.7% |
| 2023-10-30 | 0.51 | 0.54 | +5.4% |
| 2023-07-31 | 0.25 | 0.26 | +5.2% |
| 2023-05-01 | 0.18 | 0.18 | — |
| 2023-02-13 | 0.7 | 0.67 | −4.3% |
| 2022-10-31 | 0.89 | 1.24 | +39.9% |
| 2022-08-01 | 0.48 | 0.51 | +6.2% |
| 2022-05-02 | 0.57 | 0.69 | +21.1% |
| 2022-02-14 | 0.66 | 0.88 | +33.3% |
| 2021-10-25 | 0.7 | 0.74 | +5.7% |
| 2021-07-26 | 0.47 | 0.51 | +8.5% |
| 2021-04-26 | 0.46 | 0.49 | +5.7% |
| 2021-02-08 | 0.38 | 0.52 | +38.7% |
About Amkor Technology
Website ↗Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and spec…
An accelerator is useless until logic and HBM are integrated on an interposer. 2.5D/3D capacity, hybrid bonders and TC bonders gate output.
What would prove us wrong. Weakens if CoWoS expansions run ahead of accelerator demand and OSAT utilisation drops.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| TSM Taiwan Semiconductor | Leading-node foundry and CoWoS packaging chokepoint | $406.1 | −5.95% | −11.6% | +34.7% | |
| ASX ASE Technology | Largest OSAT; takes CoWoS-class overflow | $39.50 | −11.34% | −11.7% | +147.8% | |
| BESI.AS BE Semiconductor | Hybrid bonding equipment leader | €154.0 | −5.72% | −19.5% | +15.9% | |
| 042700.KS Hanmi Semiconductor | TC bonders for HBM stacking | ₩182,700 | −7.21% | −27.5% | +43.9% | |
| 6146.T Disco | Dicing and grinding for thin wafers and HBM | ¥49,540 | −5.31% | −13.8% | +3.8% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.