ASX ASE Technology
Largest OSAT; takes CoWoS-class overflow
Fundamentals from public market data, refreshed daily (2026-10-30 21:21 UTC). Figures in reporting currency.
ASX · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-07-30EarningsBeat / raise
Reported EPS 0.29 vs 0.2 expected (+43.4% surprise).
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7
2026-04-29EarningsBeat / raise
Reported EPS 0.2 vs 0.17 expected (+16.3% surprise).
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6
2026-02-05EarningsBeat / raise
Reported EPS 0.21 vs 0.2 expected (+6.2% surprise).
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5
2025-10-30EarningsBeat / raise
Reported EPS 0.16 vs 0.13 expected (+20.3% surprise).
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4
2025-07-31EarningsMiss / cut
Reported EPS 0.11 vs 0.14 expected (-23.1% surprise).
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3
2025-04-30EarningsMiss / cut
Reported EPS 0.1 vs 0.12 expected (-16.7% surprise).
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2
2025-02-13EarningsMiss / cut
Reported EPS 0.13 vs 0.15 expected (-15.4% surprise).
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1
2024-10-31EarningsMiss / cut
Reported EPS 0.13 vs 0.15 expected (-11.3% surprise).
Latest headlines
Auto-updated daily- ASX Q3 Earnings Call Highlights LEAP Growth and Capacity Constraints2026-10-30
- ASE Technology Q3 Earnings Beat Estimates on AI-Driven LEAP Growth2026-10-30
- ASE Technology Beats Q3 Targets As It Runs At Full Capacity2026-10-29
- What ASE Technology (ASX) Said on Its Q3 Earnings Call2026-10-29
- ASE Technology Hldg (ASX) Beats Q3 Earnings and Revenue Estimates2026-10-29
- ASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Third Quarter of 20262026-10-29
- ASE Technology Hldg: Q3 Earnings Snapshot2026-10-29
Alternative data that moves ASX
Earnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-07-30 | 0.2 | 0.29 | +43.4% |
| 2026-04-29 | 0.17 | 0.2 | +16.3% |
| 2026-02-05 | 0.2 | 0.21 | +6.2% |
| 2025-10-30 | 0.13 | 0.16 | +20.3% |
| 2025-07-31 | 0.14 | 0.11 | −23.1% |
| 2025-04-30 | 0.12 | 0.1 | −16.7% |
| 2025-02-13 | 0.15 | 0.13 | −15.4% |
| 2024-10-31 | 0.15 | 0.13 | −11.3% |
| 2024-07-25 | 0.11 | 0.11 | +1.0% |
| 2024-04-25 | 0.09 | 0.08 | −11.7% |
| 2024-02-01 | 0.13 | 0.13 | +1.7% |
| 2023-10-26 | 0.13 | 0.13 | −1.9% |
| 2023-07-27 | 0.1 | 0.12 | +19.6% |
| 2023-04-27 | 0.07 | 0.09 | +22.5% |
| 2023-02-09 | 0.22 | 0.23 | +4.4% |
| 2022-10-27 | 0.24 | 0.26 | +8.0% |
| 2022-07-28 | 0.2 | 0.25 | +22.0% |
| 2022-04-28 | 0.17 | 0.21 | +24.3% |
| 2022-02-10 | 0.23 | 0.5 | +121.3% |
| 2021-10-28 | 0.2 | 0.23 | +15.1% |
| 2021-07-29 | 0.14 | 0.16 | +16.2% |
| 2021-04-28 | 0.12 | 0.14 | +17.8% |
| 2021-02-04 | 0.1 | 0.16 | +61.2% |
| 2020-10-30 | 0.09 | 0.11 | +13.8% |
About ASE Technology
Website ↗ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It operates through Packaging, Testing, and EMS. The company offers semiconductor packaging, interconnect materials production, front-end engineering testing, wafer probing, and final testing services, as well as integrated solutions for EMS (electronic manufacturing services) in relation to computing, peripherals, communications, industrial, automotive, and server applications. It also provides turnkey services, such as packaging, testing, and direct shipment of semiconductors to end users; wire bonding, including lead frame and substrate-based packages; advanced packages; heterogeneous integration; and other test-related services. In addition, the company engages in the leasing of properties; development…
An accelerator is useless until logic and HBM are integrated on an interposer. 2.5D/3D capacity, hybrid bonders and TC bonders gate output.
What would prove us wrong. Weakens if CoWoS expansions run ahead of accelerator demand and OSAT utilisation drops.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| TSM Taiwan Semiconductor | Leading-node foundry and CoWoS packaging chokepoint | $406.1 | −5.95% | −11.6% | +34.7% | |
| AMKR Amkor Technology | Advanced packaging OSAT incl. US capacity | $39.50 | −4.15% | −25.3% | +0.5% | |
| BESI.AS BE Semiconductor | Hybrid bonding equipment leader | €154.0 | −5.72% | −19.5% | +15.9% | |
| 042700.KS Hanmi Semiconductor | TC bonders for HBM stacking | ₩182,700 | −7.21% | −27.5% | +43.9% | |
| 6146.T Disco | Dicing and grinding for thin wafers and HBM | ¥49,540 | −5.31% | −13.8% | +3.8% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.