Japan / Taiwan · Chips & Networking
Chip Substrates (ABF & Glass)
Large AI packages need big, many-layer ABF substrates. The build-up film itself comes from one supplier; glass-core substrates are the next transition.
ABF film→Core→Build-up layers→Package
64
Tightness score ⓘ
#30 of 56
▲ Tightening
Lead time
12–24 mo
Theme 1M
−11.4%% in uptrend
0%Metric to watch
Ibiden/Unimicron capacity adds, ABF film supply commentary, and glass-core qualification news.
What would prove us wrong
Weakens if substrate makers report utilisation falling while AI package sizes keep growing.
Dependencies
Substrates theme performance
Equal-weight · rebased 100 · 1YStocks we track
Who controls this bottleneck
Roles, not recommendations. Delayed prices; local currency.
| Stock | Role | Listing | Last | 1D | 1M | 3M | YTD | Off 52w high | Trend | Next earnings |
|---|---|---|---|---|---|---|---|---|---|---|
| 4062.T Ibiden |
High-end ABF substrates for AI accelerators | TSE Japan |
¥8,359.0 | −15.21% | −24.2% | +12.6% | +149.1% | −36.7% | 2026-10-29 | |
| 3037.TW Unimicron |
ABF substrate capacity | TWSE Taiwan |
NT$989.0 | −4.90% | −15.1% | +43.8% | +350.5% | −25.4% | 2026-10-27 | |
| 8046.TW Nan Ya PCB |
ABF substrates | TWSE Taiwan |
NT$1,190.0 | −4.80% | −6.3% | +35.4% | +394.8% | −20.9% | — | |
| 2802.T Ajinomoto |
Sole major supplier of ABF build-up film | TSE Japan |
¥5,118.0 | −0.39% | +0.1% | +5.2% | +55.9% | −16.7% | 2026-11-09 |