AMAT Applied Materials
Deposition and materials engineering across logic, DRAM and packaging
Fundamentals from public market data, refreshed daily (2026-10-30 21:21 UTC). Figures in reporting currency.
AMAT · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-08-13EarningsBeat / raise
Reported EPS 3.5 vs 3.39 expected (+3.1% surprise).
-
7
2026-05-14EarningsBeat / raise
Reported EPS 2.86 vs 2.69 expected (+6.5% surprise).
-
6
2026-02-12EarningsBeat / raise
Reported EPS 2.38 vs 2.21 expected (+7.9% surprise).
-
5
2025-11-13EarningsBeat / raise
Reported EPS 2.17 vs 2.09 expected (+3.6% surprise).
-
4
2025-08-14EarningsBeat / raise
Reported EPS 2.48 vs 2.36 expected (+5.1% surprise).
-
3
2025-05-15EarningsBeat / raise
Reported EPS 2.39 vs 2.31 expected (+3.5% surprise).
-
2
2025-02-13EarningsBeat / raise
Reported EPS 2.38 vs 2.3 expected (+3.7% surprise).
-
1
2024-11-14EarningsBeat / raise
Reported EPS 2.32 vs 2.19 expected (+5.7% surprise).
Latest headlines
Auto-updated daily- Applied Materials Is Up Nearly 9% Since Moving to Lift Its Besi Stake to 20%. Here’s What Hybrid Bonding Could Mean for the Stock by 20302026-10-30
- Applied Materials, Inc. (AMAT) is Attracting Investor Attention: Here is What You Should Know2026-10-30
- Applied Materials vs. Taiwan Semiconductor Manufacturing: Comparing Revenue Growth Trends Between These Artificial Intelligence Companies2026-10-30
- Is Applied Materials Still The Company You Bought?2026-10-29
- Applied Materials (AMAT) Moved, What Is Drawing Fresh Attention?2026-10-28
- Chip Equipment Stocks Rally as SK Hynix Signals Memory Shortage Into 2030: Lam Research Jumps 5%, Applied Materials Climbs 4%, KLA Gains 3%2026-10-28
Predictions involving AMAT
Earnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-08-13 | 3.39 | 3.5 | +3.1% |
| 2026-05-14 | 2.69 | 2.86 | +6.5% |
| 2026-02-12 | 2.21 | 2.38 | +7.9% |
| 2025-11-13 | 2.09 | 2.17 | +3.6% |
| 2025-08-14 | 2.36 | 2.48 | +5.1% |
| 2025-05-15 | 2.31 | 2.39 | +3.5% |
| 2025-02-13 | 2.3 | 2.38 | +3.7% |
| 2024-11-14 | 2.19 | 2.32 | +5.7% |
| 2024-08-15 | 2.03 | 2.12 | +4.7% |
| 2024-05-16 | 1.99 | 2.09 | +5.3% |
| 2024-02-15 | 1.91 | 2.13 | +11.8% |
| 2023-11-16 | 1.99 | 2.12 | +6.4% |
| 2023-08-17 | 1.75 | 1.9 | +8.9% |
| 2023-05-18 | 1.83 | 2.0 | +9.5% |
| 2023-02-16 | 1.92 | 2.03 | +5.7% |
| 2022-11-17 | 1.74 | 2.03 | +16.9% |
| 2022-08-18 | 1.78 | 1.94 | +8.7% |
| 2022-05-19 | 1.9 | 1.85 | −2.8% |
| 2022-02-16 | 1.85 | 1.89 | +1.9% |
| 2021-11-18 | 1.96 | 1.94 | −0.9% |
| 2021-08-19 | 1.78 | 1.9 | +6.8% |
| 2021-05-20 | 1.51 | 1.63 | +7.9% |
| 2021-02-18 | 1.28 | 1.39 | +8.8% |
| 2020-11-12 | 1.17 | 1.25 | +6.7% |
About Applied Materials
Website ↗Applied Materials, Inc. provides materials engineering solutions, equipment, services, and software to the semiconductor and related industries in the United States, China, Korea, Taiwan, Japan, Southeast Asia, Europe, and internationally. The company operates through Semiconductor Systems and Applied Global Services (AGS) segments. The Semiconductor Systems segment includes semiconductor capital equipment to enable materials engineering steps, including etch, rapid thermal processing, deposition, chemical mechanical planarization, metrology and inspection, wafer packaging, and ion implantation. The AGS segment offers integrated solutions to optimize equipment and fab performance and productivity comprising spares, upgrades, services, and 200 millimeter and other equipment and factory automation software for semiconductor and other products. It serves manufacturers of semiconductor wafer…
Gate-all-around transistors, backside power and HBM stacking add process steps. More steps per wafer means more tool spend per unit of capacity.
What would prove us wrong. Weakens if WFE growth stalls while leading-node and HBM capacity keep expanding — tools would not be the gate.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| LRCX Lam Research | Etch and deposition critical for GAA and HBM | $239.1 | −6.01% | −29.7% | +40.1% | |
| KLAC KLA | Process control and inspection at leading nodes | $157.9 | −5.69% | −21.2% | +30.4% | |
| 8035.T Tokyo Electron | Coater/developer, etch and deposition tools | ¥9,514.0 | −5.19% | −19.5% | +44.8% | |
| ASM.AS ASM International | ALD/epitaxy for gate-all-around transistors | €729.8 | −7.57% | −18.6% | +41.5% | |
| ONTO Onto Innovation | Advanced-packaging metrology and lithography | $201.6 | −9.16% | −36.0% | +27.7% | |
| CAMT Camtek | Inspection for HBM and advanced packaging | $116.7 | −7.89% | −24.1% | +9.7% | |
| NVMI Nova | Dimensional and materials metrology | $312.2 | −6.68% | −19.2% | −4.9% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.