2383.TW Elite Material
Low-loss copper-clad laminate for AI boards
Fundamentals from public market data, refreshed daily (2026-10-30 21:21 UTC). Figures in reporting currency.
2383.TW · price with what management and the data said
Timeline: management commentary, data & earnings
8 events-
8
2026-10-28EarningsBeat / raise
Reported EPS 40.44 vs 36.07 expected (+12.1% surprise).
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7
2026-07-29EarningsBeat / raise
Reported EPS 27.55 vs 24.62 expected (+11.9% surprise).
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6
2026-04-29EarningsMiss / cut
Reported EPS 14 vs 15.08 expected (-7.2% surprise).
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5
2026-03-11EarningsMiss / cut
Reported EPS 10.44 vs 10.77 expected (-3.1% surprise).
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4
2025-10-30EarningsMiss / cut
Reported EPS 11.06 vs 11.95 expected (-7.5% surprise).
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3
2025-07-30EarningsMiss / cut
Reported EPS 9.62 vs 10.28 expected (-6.4% surprise).
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2
2025-04-30EarningsBeat / raise
Reported EPS 9.72 vs 9.3 expected (+4.5% surprise).
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1
2025-02-25EarningsMiss / cut
Reported EPS 7.67 vs 7.74 expected (-0.8% surprise).
Latest headlines
Auto-updated dailyEarnings history
EPS vs expectations| Date | Expected EPS | Reported EPS | Surprise |
|---|---|---|---|
| 2026-10-28 | 36.07 | 40.44 | +12.1% |
| 2026-07-29 | 24.62 | 27.55 | +11.9% |
| 2026-04-29 | 15.08 | 14.0 | −7.2% |
| 2026-03-11 | 10.77 | 10.44 | −3.1% |
| 2025-10-30 | 11.95 | 11.06 | −7.5% |
| 2025-07-30 | 10.28 | 9.62 | −6.4% |
| 2025-04-30 | 9.3 | 9.72 | +4.5% |
| 2025-02-25 | 7.74 | 7.67 | −0.8% |
| 2024-10-31 | 7.6 | 7.25 | −4.6% |
| 2024-07-31 | 7.01 | 7.01 | +0.0% |
| 2024-04-29 | 5.76 | 5.69 | −1.2% |
| 2024-02-29 | 6.18 | 5.85 | −5.4% |
| 2023-10-25 | 5.95 | 5.79 | −2.7% |
| 2023-07-26 | 2.83 | 2.86 | +0.9% |
| 2023-05-01 | 1.44 | 1.39 | −3.5% |
| 2023-02-23 | 3.32 | 3.89 | +17.2% |
| 2022-10-27 | 3.86 | 3.81 | −1.4% |
| 2022-07-27 | 3.63 | 3.22 | −11.3% |
| 2022-04-27 | 3.9 | 3.97 | +1.8% |
| 2022-02-23 | 4.71 | 4.46 | −5.3% |
| 2021-10-27 | 4.48 | 5.37 | +19.9% |
| 2021-07-28 | 3.45 | 3.75 | +8.8% |
| 2021-04-28 | 2.91 | 2.89 | −0.6% |
| 2021-02-24 | 3.02 | 2.92 | −3.5% |
About Elite Material
Website ↗Elite Material Co., Ltd. engages in the manufacturing and sales of copper clad laminates, electronic-industrial specialty chemical and raw materials, and electronic components in Taiwan, China, and internationally. The company also offers printed circuit boards, prepreg, and adhesive sheets. Its products are used in various industries, including mobile devices, infrastructure, automotives, aerospace, military, industrial, and autonomous driving applications. The company was incorporated in 1992 and is headquartered in Taoyuan City, Taiwan.
AI accelerator boards and switch trays need high-layer, low-loss PCBs and copper-clad laminate. Few makers qualify, and layer counts rise every generation.
What would prove us wrong. Weakens if PCB makers add high-layer capacity faster than AI board volumes grow.
Who else supplies this
| Stock | Role | Last | 1D | 1M | YTD | Trend |
|---|---|---|---|---|---|---|
| 2368.TW Gold Circuit Electronics | High-layer PCBs for AI servers and switches | NT$1,020.0 | −8.52% | −8.9% | +49.5% | |
| 6274.TWO Taiwan Union Technology | High-speed copper-clad laminate | NT$1,265.0 | −8.99% | −14.8% | +158.1% | |
| TTMI TTM Technologies | Advanced PCBs for data centers and defence | $82.94 | −5.35% | −34.4% | +20.2% | |
| 4958.TW Zhen Ding Technology | PCBs and substrates | NT$486.0 | −6.54% | −2.5% | +244.6% |
Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.