Daily
AI Infrastructure Daily: everything that happened across chips, memory, power, data centers and financing in a 3-minute read, every weekday. Free. Read today's →
NVDA$204.6−4.22%TSM$406.1−5.95%SK hynix₩1,418,000−7.08%Samsung Electronics₩225,000−3.02%MU$884.7−5.30%ASML$1,565.9−6.55%AVGO$326.1−5.48%LITE$840.7−8.57%COHR$210.3−11.34%ANET$168.9−8.34%GEV$857.9−3.38%ETN$370.0−6.03%VRT$232.5−5.46%CEG$262.4−0.83%VST$138.4−1.83%PWR$620.7−2.27%HD Hyundai Electric₩424,500−3.63%MP$39.57−4.97%FCX$62.47−5.55%CCJ$76.91−7.88%MSFT$521.9−1.55%META$615.0−1.53%CRWD$250.4−4.10%SMH$522.5−6.98%SPY$755.7−1.77%
NASDAQ · US · Electronic Components

TTMI TTM Technologies

Advanced PCBs for data centers and defence

Tight but sold off Its supply chain is tightening but the stock is below its 50-day average — price and fundamentals disagree. (automatic: supply-chain trend + price vs 50-day average)
Last close (delayed) · 2026-10-30
$82.94
−5.35% today
1W
+3.5%
1M
−34.4%
3M
−31.6%
YTD
+20.2%
1Y
+33.8%
Off 52w high
−62.5%
Next earnings (est.): 2026-10-22
Market cap$8.74B
P/E (trailing)33.2Forward 9.9
EV / sales2.6×EV/EBITDA 17.3×
Revenue (TTM)$3.83BGrowth 59.9% y/y
Margins22.2%gross · op 13.5%
Free cash flow$27.33MCash $887M · debt $1.79B
Analyst target$185.8+124.0% upside · 5 analysts · strong buy
Riskβ 2.14Short 6.6% of float

Fundamentals from public market data, refreshed daily (2026-10-30 21:21 UTC). Figures in reporting currency.

TTMI · price with what management and the data said

Supply tighteningBeat / raiseMiss / cutData releaseEasing Hover a numbered marker for details · dashed lines = 50- and 200-day averages

Timeline: management commentary, data & earnings

8 events
  1. 8
    2026-10-22EarningsBeat / raise

    Reported EPS 1.46 vs 1.26 expected (+16.1% surprise).

  2. 7
    2026-08-05EarningsBeat / raise

    Reported EPS 0.99 vs 0.9 expected (+10.3% surprise).

  3. 6
    2026-04-29EarningsBeat / raise

    Reported EPS 0.75 vs 0.67 expected (+12.4% surprise).

  4. 5
    2026-02-04EarningsBeat / raise

    Reported EPS 0.7 vs 0.68 expected (+2.6% surprise).

  5. 4
    2025-10-29EarningsBeat / raise

    Reported EPS 0.67 vs 0.6 expected (+11.2% surprise).

  6. 3
    2025-07-30EarningsBeat / raise

    Reported EPS 0.58 vs 0.52 expected (+11.0% surprise).

  7. 2
    2025-04-30EarningsBeat / raise

    Reported EPS 0.5 vs 0.4 expected (+26.6% surprise).

  8. 1
    2025-02-05EarningsBeat / raise

    Reported EPS 0.6 vs 0.47 expected (+26.8% surprise).

Earnings history

EPS vs expectations
DateExpected EPSReported EPSSurprise
2026-10-221.261.46+16.1%
2026-08-050.90.99+10.3%
2026-04-290.670.75+12.4%
2026-02-040.680.7+2.6%
2025-10-290.60.67+11.2%
2025-07-300.520.58+11.0%
2025-04-300.40.5+26.6%
2025-02-050.470.6+26.8%
2024-10-300.410.41+0.6%
2024-07-310.340.39+14.7%
2024-05-010.270.31+13.8%
2024-02-070.360.41+13.1%
2023-11-010.280.43+56.4%
2023-08-020.20.32+60.0%
2023-05-030.190.18−4.0%
2023-02-080.380.41+7.2%
2022-11-020.440.56+28.7%
2022-08-030.330.54+64.5%
2022-05-040.230.24+2.9%
2022-02-090.310.34+9.7%
2021-10-270.340.34+1.0%
2021-07-280.30.36+21.4%
2021-04-280.230.23−0.6%
2021-02-030.250.37+46.3%

About TTM Technologies

Website ↗

TTM Technologies, Inc. manufactures and sells mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and printed circuit boards (PCBs) and substrates in the United States, Taiwan, and internationally. It operates in three segments, A&D, Commercial, and RF&S Components. The company offers various engineered systems and RF and microwave assemblies; PCBs and IC substrates, custom assemblies and integrated systems, passive and advanced ceramic RF components, hi-reliability multi-chip modules, and beamforming and switching networks; and design-for-manufacturability, PCB layout design, simulation and testing, quick turnaround (QTA) production, and specialized RF assembly and testing. It also provides multi-mode surveillance and weather avoidance radar systems for fixed- and rotary-wing aircraft, Unmanned Aerial Vehicles, and shipboard platforms; AN/APS-153 m…

18,200 employees · Santa Ana, United States

AI accelerator boards and switch trays need high-layer, low-loss PCBs and copper-clad laminate. Few makers qualify, and layer counts rise every generation.

Glass fabric + copper foil→Laminate (CCL)→PCB→Board

What would prove us wrong. Weakens if PCB makers add high-layer capacity faster than AI board volumes grow.

Peers at the same bottleneck

Who else supplies this

StockRoleLast1D1MYTDTrend
2368.TW
Gold Circuit Electronics
High-layer PCBs for AI servers and switches NT$1,020.0−8.52%−8.9%+49.5%
2383.TW
Elite Material
Low-loss copper-clad laminate for AI boards NT$4,675.0−6.69%−5.0%+185.5%
6274.TWO
Taiwan Union Technology
High-speed copper-clad laminate NT$1,265.0−8.99%−14.8%+158.1%
4958.TW
Zhen Ding Technology
PCBs and substrates NT$486.0−6.54%−2.5%+244.6%

Not investment advice. Prices delayed and in local currency. Quotes in "double quotes" are verbatim as reported by the linked source; other commentary is our paraphrase. Earnings dates are estimates.